Advanced Packaging and Heterogeneous Integration Technology Lead

Essential Duties:

Lead research and development of novel 2.5D and 3D heterogeneous integration technologies for Radio-Frequency (RF) and Millimeter-Wave (mmW) applications (e.g. next generation RF/mmW Phased-Array Systems), with attention to all facets of this endeavor from conceptual design phase considering electrical, thermal, mechanical design constraint to engineering and manufacturing, as well as verification and validation phase.

Address all levels of integration from chip-level to module & microsystem level (e.g. die and wafer stacking, WLFO).

Perform theory-driven analyses of candidate approaches.

Organize and manage research and development projects to be carried out by technical teams of other domain experts (e.g. in each of the technical areas mentioned above).

Provide mentorship and guidance to others in all aspects of these projects (technical, organization, reporting, etc.). Develop and maintain relationships with relevant vendors and partner organizations.

Organize and present results, in written reports, journal papers, and oral presentations.

Create and manage work plans to meet or exceed schedule deadlines and technical expectations.

Strong leadership and contributions to proposal and marketing efforts required to sustain continued R&D efforts.

Required Skills:

More than 15-20 years of hands-on experience with developing novel 2.5D and 3D microelectronic packaging and heterogeneous integration for RF & mmW microsystems.

Extensive experience with design of experiments and analysis techniques (electrical, mechanical, thermal, chemical, etc.) needed to develop and assess new process integration modules and techniques. 

Experience with leading US government proposal and marketing activities.

Demonstrated experience developing external partnerships and vendor relationships. 

Several years of experience in organizing and leading technical research and development efforts, and in preparing presentations and proposals needed to attract research funding. 

Experience with traditional as well as advanced packaging techniques (e.g. ceramic and laminate chip-level packages, printed circuit boards, SoC, SiP, MCM, HD interposers, etc.).

Hands-on experience with semiconductor microfabrication is a plus.

Candidates should possess a proven track record of developing novel and successful solutions to complex technical issues.

Extensive knowledge of RF/mmW (0.1-200+ GHz) with strong electromagnetic (EM) background is desired.  

Extensive knowledge of semiconductor microfabrication is desired.

Knowledge of multi-physics simulation tools (e.g. ANSYS, COMSOL), high frequency and RF simulation tools (e.g. ADS, MWO, Cadence), electromagnetic simulation tools (e.g. HFSS or CST) is desired.

Familiarity with digital, mixed-signal, power and signal integrity is desired

Knowledge of system engineering, program and project management is a plus.

Understanding of material science, surface chemistry, semiconductor physics, and thermal/mechanical theory related to electronics processing and assembly techniques is a plus.

Proficiency in use of computers, engineering workstations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment.

Ability to work well in a team and independently

Required Education:

Ph.D. degree in Electrical Engineering, Mechanical Engineering, Physics, or related scientific discipline. 

Physical Requirements:

Must be sufficiently mobile to work within confined spaces and have both visual and hearing acuity.

Special Requirements:

Current U.S. person or US citizen status is required. 

Active security clearance is a plus.

Compensation:

The base salary range for this full-time position is $182,720 - $234,168 + bonus + benefits.

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range during the hiring process. Please note that the compensation details listed reflect the base salary only, and do not include potential bonus or benefits.